Product Summary

The XCS20-3TQG144C is a high-volume production FPGA solution that delivers all the key requirements for ASIC replacement up to 40,000 gates. These requirements of the XCS20-3TQG144C include high performance, on-chip RAM, core solutions and prices that, in high volume, approach and in many cases are equivalent to mask programmed ASIC devices. By streamlining the Spartan series feature set, leveraging advanced process technologies and focusing on total cost management, the XCS20-3TQG144C delivers the key features required by ASIC and other high-volume logic users while avoiding the initial cost, long development cycles and inherent risk of conventional ASICs.

Parametrics

XCS20-3TQG144C absolute maximum ratings: (1)VCC Supply voltage relative to GND: –0.5 to +7.0 V; (2)VIN Input voltage relative to GND: –0.5 to VCC +0.5 V; (3)VTS Voltage applied to 3-state output: –0.5 to VCC +0.5 V; (4)TSTG Storage temperature (ambient): –65 to +150 ℃; (5)TJ Junction temperature Plastic packages: +125 ℃.

Features

XCS20-3TQG144C features: (1)First ASIC replacement FPGA for high-volume production with on-chip RAM; (2)Density up to 1862 logic cells or 40,000 system gates; (3)Streamlined feature set based on XC4000 architecture; (4)System performance beyond 80 MHz; (5)Broad set of AllianceCORE and LogiCORE predefined solutions available; (6)Unlimited reprogrammability; (7)Low cost.

Diagrams

XCS20-3TQG144C block diagram

XCS20 and XCS20XL
XCS20 and XCS20XL

Other


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Data Sheet

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